遥遥领先Skyworks推出SKY66431 SiP专用于物联网通信系统

Skyworks and Sequans Introduce the World’s Smallest LTE-M/NB-IoT System-in-Package Solution

Highly Integrated SKY66431 SiP Delivers Robust Solution for Massive IoT Communication Systems; Simplifies Design and Improves Battery Life

Skyworks Solutions, Inc. (Nasdaq: SWKS), and Sequans Communications S.A. (NYSE: SQNS), today introduced the SKY66431, a 5G Massive IoT SiP (system-in-package) solution. This next-generation SiP combines Sequans’ Monarch 2 modem with Skyworks’ industry-leading RF front-end solution, creating the world’s smallest LTE-M/NB-IoT connectivity platform in a single package.

Essential to critical infrastructure, low-power wide-area network (LPWAN) products meet stringent operational requirements for durability, battery lifespan and reliability. Designed to address the increasing demand for form-factor driven cellular LPWAN end points, the SKY66431 is ideally suited for utility meters, asset trackers, security and alert systems and other battery-powered devices such as wearable medical and fleet management. The number of installed LPWAN devices is expected to reach 2.4 billion by 20261.

The SKY66431 is a highly integrated multi-band, multi-chip SiP supporting 5G Massive IoT platforms, offering high performance connectivity with ultra-low power consumption. Its native 23 dBm front-end module leverages Skyworks’ RF design and advanced packaging expertise that optimizes reliability in demanding environments and allows for extremely small footprint designs while maintaining simplified PCB design rules. With SiP form factor-enabling miniaturization and fully encapsulated silver-free conformal shielding, the SKY66431 package is a key differentiator enabling ultra-compact, flexible and robust end-product designs.

The SKY66431 is being certified by a number of industry and regulatory agencies, as well as multiple network operators. This SiP is available now for select customers, with general availability expected in the first quarter of 2023.

“As modern connected devices evolve, Skyworks’ extensive expertise within this market and advanced packaging technologies allow us to drive improvements in power consumption, size and advanced connectivity features to meet the rigorous performance requirements of our customers,” said Stefan Fulga, senior director of marketing for IoT and emerging products at Skyworks. “The SKY66431 SiP enables simplified, yet high performance designs that operate reliably worldwide, accelerating time-to-market for our customers.”

遥遥领先Skyworks推出SKY66431 SiP专用于物联网通信系统

Skyworks和Sequans推出世界上最小的LTE-M/NB-IoT系统级封装解决方案

高度集成的小体积晶振SKY66431 SiP为大规模物联网通信系统提供强大的解决方案；简化设计并延长电池寿命

Skyworks思佳讯电子解决方案公司。(纳斯达克股票代码:SWKS)，以及Sequans通信有限公司(纽约证券交易所代码:SQNS)，今天推出了SKY66431，5G海量物联网SiP(系统级封装)解决方案。这款下一代SiP将Sequans的Monarch 2调制解调器与Skyworks晶振厂家行业领先的RF前端解决方案相结合，在单个封装中创建了世界上最小的LTE-M/NB-IoT连接平台。
对于关键基础设施而言，低功耗广域网(LPWAN)产品至关重要，可满足耐用性、电池寿命和可靠性方面的严格操作要求。SKY66431旨在满足对外形驱动的蜂窝LPWAN端点日益增长的需求，非常适合公用事业仪表、资产跟踪器、安全和报警系统以及可穿戴医疗和车队管理等其他电池供电设备。到2026年，安装的LPWAN设备数量预计将达到24亿台1.
Skyworks思佳讯SKY66431是一款高度集成的多频段、多芯片SiP，支持5G大规模物联网平台，以超低功耗提供高性能连接。其原生23 dBm前端模块利用了Skyworks的RF设计和先进的封装专业知识，优化了苛刻环境中的可靠性，允许极小尺寸设计，同时保持简化的PCB设计规则。石英贴片晶振SKY66431封装采用支持小型化的SiP外形和完全封装的无银共形屏蔽，是实现超紧凑、灵活和鲁棒最终产品设计的关键优势。

Skyworks思佳讯SKY66431正在接受多家行业和监管机构以及多家网络运营商的认证。该SiP现已面向特定客户推出，预计将于2023年第一季度全面上市。
“随着现代互联设备的发展，Skyworks在该市场的广泛专业知识和先进的封装技术使我们能够推动功耗、尺寸和高级连接功能的改进，以满足客户的严格性能要求，”表示斯特凡·富尔加，物联网和新兴产品高级营销总监Skyworks。“SKY66431 SiP实现了简化但高性能的设计，可在全球范围内可靠运行，加快了我们客户的上市时间。”

Skyworks思佳讯石英晶振“新的SKY66431 SiP是一款极具吸引力的物联网连接解决方案，”表示乔治·卡拉姆Sequans的首席执行官。“这是一个全面的一体化平台，结合了两家行业领导者的技术，在一个强大的微型SiP中包含了所需的所有关键组件，非常适合广泛的物联网应用，从可穿戴设备，包括医疗设备和追踪器，到复杂的智能公用事业仪表，需要先进的封装和功能。”