HE-MCC-21-32.768K-12.5,2012mm,32.768KHz,HEC音叉晶体

产品简介

HE-MCC-21-32.768K-12.5,2012mm,32.768KHz,HEC音叉晶体，美国进口晶振，HEC晶振，编码为：HE-MCC-21-32.768K-12.5，频率：32.768KHz，负载电容：12.5pF，紧密公差：±20ppm，工作温度范围：-40℃至+85℃，小体积晶振尺寸：2.0x1.2mm封装，两脚贴片晶振，音叉晶体，石英晶振，无源晶振，SMD晶振，石英晶体谐振器，2012晶振。具有超小型，轻薄型，高性能，高品质，耐热及耐环境等特点。应用于：智能穿戴设备晶振，通讯设备晶振，时钟晶振，平板电脑晶振，数字显示晶振，数码电子等应用。

产品详情

HE-MCC-21-32.768K-12.5,2012mm,32.768KHz,HEC音叉晶体，产品特点：

•绝缘电阻：最小500MΩ@直流100V
•温度系数：-0.034±0.006ppm/℃²
•符合ROHS

HE-MCC-21-32.768K-12.5,2012mm,32.768KHz,HEC音叉晶体,参数表

PARAMETERS	CONDITIONS	MINIMUM	STANDARD	MAXIMUM	UNIT
FREQUENCY RANGE			32.768		KHz
FREQ. TOLERANCE	at 25 °C		±20		PPM
DRIVE LEVEL			10μW typical 100μW Max.
OPERATING TEMPERATURE		-40 °C to +85 °C			°C
STORAGE TEMPERATURE		-40 °C to +85 °C			°C
SHUNT CAPACITANCE (CO)				1.5	pF
LOAD CAPACITANCE (CL)			12.5 pF		pF
ESR			70KΩMax.
AGING CHARACTERISTICS			±3 PPM / year
TEMPERATURE COEFFICIENT -0.034±0.006ppm/℃²